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<group name="Electronic Pd/Ag Plating">



	<subgroup name ="Pure Pd Plating">

		<product>

			<pname>PallaTech Pd LF</pname>

			<introduction>

				<li>For lead frames and semi-conductor devices </li>

				<li>Rate:1ASD 8.8-10.4¼-inch/min</li>

			</introduction>

		</product>

                

		<advantage>

			<li>HS, Bright, flexibly</li>

			<li>Excellent solderability and wirebonding</li>

			<li>Environmentally friendly</li>

		</advantage>



		<operating>

			<li>Temp: 35-45!</li>

			<li>Pd: 5-20g/L</li>

			<li>pH : 7.0-8.0 </li>

			<li>0.5-15ASDs</li>

			<li>Anode: Platinum clad titanium</li>

		</operating>

	</subgroup>

	

	<subgroup name ="PdCo Platign">

		<product>

			<pname>PallaTech PdCo LF</pname>

			<introduction>

				<li>For lead frames and semi-conductor devices</li>

				<li>Rate: 1ASD 0.2¼m/min</li> 

			</introduction>

		</product>



		<product>

			<pname>PallaTech PdCo PC2 HS</pname>

			<introduction>

				<li>HS, For electronic component </li>

				<li>Rate: 10ASD 1.35¼m/min</li> 

			</introduction>

		</product>



		<advantage>

			<li>Bright, Excellent ductility</li>

			<li>Excellent solderability and wirebonding through steam test</li>

			<li>Exceptional contact stability, wear resistance</li>

			<li>Environmentally friendly</li>

		</advantage>



		<operating>

			<li>Temp:30-50!(LF)45-60!(HS)</li>

			<li>Pd : 2-6 g/L(LF)      35-45g/L(HS)</li>

			<li>Co : 0.2-0.6 g/L(LF)      6-10g/L(HS) </li>

			<li>0.5-2 ASD(LF)5-70ASD(HS)</li>

			<li>Anode: Platinum clad titanium</li>

		</operating>

	</subgroup>



	<subgroup name ="Protect Dipping">

		<product>

			<pname>PallaTech EBI</pname>

			<introduction>

				<li>Post plating treatment for the inhibition of epoxy bleed</li>

			</introduction>

		</product>

                

		<advantage>

			<li>Inhibit epoxy bleed on Palladium or Gold surface  </li>

			<li>No negative effect on wirebonding or solderability</li>

			<li>Improve EBO test</li>

			<li>Handling is easy, no need to drag out rinse</li>

		</advantage>



		<operating>

			<li>Ambient</li>

			<li>Concentration: 0.5-3%</li>

			<li>Dipping time: 3-30sec</li>

		</operating>

	</subgroup>





	<subgroup name ="HS PdNi Platign">

		<product>

			<pname>PallaTech PdNi NFS HS </pname>

			<introduction>

				<li>Pd :75±5%, wear resistance, Better than either hard gold or pure palladium</li>

			</introduction>

		</product>



		<product>

			<pname>PallaTech PdNi M HS</pname>

			<introduction>

				<li>Lower ammonia, PdNi ratio relative constant, Pd :75±5%</li>

				<li>Less cost than PdNi, Environmentally friendly</li>

			</introduction>

		</product>

                

		<advantage>

			<li>Bright, Excellent ductility</li>

			<li>Low porosity, contact stable</li>

			<li>HS, 10ASD 2.5¼m/min</li>

		</advantage>



		<operating>

			<li>Temp: 30-50!(NFS HS)         30-55! (M HS)</li>

			<li>Pd : 15-30g/L</li>

			<li>Ni : 12-25g/L</li>

			<li>pH: 7.5-8.5(NFS HS)7.0-7.5(M HS)</li>

			<li>4-50ASD</li>

			<li>Anode: Platinum clad titanium</li>

		</operating>

	</subgroup>



	<subgroup name ="Preditting Ag">

		<product>

			<pname>SilvaTech HS Predip</pname>

			<introduction>

				<li>Specifically designed to prevent while copper alloy lead frame in silver solution form chemical silver deposit</li>

			</introduction>

		</product>

                

		<advantage>

			<li>Inhibit silver immersion deposits</li>

			<li>No preplating silver</li>

			<li>Free cyanide</li>         

		</advantage>



		<operating>

			<li>Temp:20-30!</li>

			<li>Concentration: 2%</li>

			<li>pH: 8-10</li>

			<li>Dipping time:1-30sec</li>

		</operating>

	</subgroup>



	<subgroup name ="Silver Plating">

		<product>

			<pname>SilvaTech HS 2</pname>

			<introduction>

				<li>HS</li>

				<li>Utilized to lead frames and semiconductor devices</li>

				<li>Rate: 120¼m/min</li>     

			</introduction>

		</product>



		<product>

			<pname>SilvaTech LS</pname>

			<introduction>

				<li>LS</li>

				<li>For decorative plating</li>

				<li>Rate: 1.67¼m/min</li>     

			</introduction>

		</product>

                

		<advantage>

			<li>Low cyanide</li>

			<li>Highly ductile, exceptional solderability and wirebonding</li>

			<li>High resistance to heat</li>

		</advantage>



		<operating>

			<li>Temp:55-75!(HS2)20-25!(LS)</li>

			<li>Ag : 40-80g/L(HS2)32-40g/L(LS) </li>

			<li>90-200ASD(HS2)0.3-3ASD(LS)</li>

			<li>Anode: Platinum clad titanium</li>

		</operating>

	</subgroup>



	<subgroup name ="Strip Ag">

		<product>

			<pname>SilvaTech HS Backstripper</pname>

			<introduction>

				<li>Anodic silver stripper</li>

				<li>Rate:   0.5¼-inch/sec @3ASD</li>

			</introduction>

		</product>

                

		<advantage>

			<li>No cyanide, emvironmentally friendly</li>

			<li>without damage to the base metal</li>

		</advantage>



		<operating>

			<li>Temp:20-28!</li>

			<li>Content:35-45g/l</li>

			<li>pH: 8-10</li>

			<li>1-5ASD</li>

			<li>Time:0.5-1.5min</li>

		</operating>

	</subgroup>



</group>