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<group name="Electronic Ni/Au Plating">



	<subgroup name ="LS Nickel Plating">

		<product>

			<pname>NickelTech EC1 LS</pname>

			<introduction>

				<li>LS, For rack and barrel Platingequipment</li>

				<li>Rate: 3ASD 0.6¼m/min</li>

			</introduction>

		</product>

                

		<product>

			<pname>NickelTech EC1 HS</pname>

			<introduction>

				<li>HS, For Reel to Reel Plating equipment</li>

				<li>Rate: 30ASD 6.6¼m/min</li>

			</introduction>

		</product>



		<advantage>

			<li>Handling is easy</li>

			<li>Ductility: 11-20%</li>     

		</advantage>



		<operating>

			<li>Temp: 55-65!</li>

			<li>Ni:70-80g/l (LS)     100-130g/l (HS) </li>

			<li>pH:3.0-4.0</li>

			<li>1-5ASD(LS)  5-50ASD(HS)</li>

			<li>Anode: Contain Nickel Sulphate</li>

		</operating>

	</subgroup>



	<subgroup name ="High ductility Ni Plating">

		<product>

			<pname>NickelTech MLS</pname>

			<introduction>

				<li>Specifically designed to lead  frames and connector</li>

				<li>Rate: 10ASD 2.1¼m/min</li>

			</introduction>

		</product>

                

		<advantage>

			<li>Flexibly, Excellent ductility</li>

			<li>Ductility: 25-33%</li>  

		</advantage>



		<operating>

			<li>Temp:55-65!</li>

			<li>Ni: 75-90g/L(rack)     100-130g/l(Reel to Reel)</li>

			<li>pH : 2.0-2.5</li>

			<li>5-30ASD</li>

			<li>Anode: Contain Nickel Sulphate</li>

		</operating>

	</subgroup>



	<subgroup name ="Pure Au Plating">

		<product>

			<pname>AuRoTech P2+</pname>

			<introduction>

				<li>For wire and die bond</li>

				<li>Rate: 0.3ASD 8¼-inch /min</li>

			</introduction>

		</product>

                

		<advantage>

			<li>Bright, Semi-bright, Flexibly</li>

			<li>High Purity(99.9%)</li>

			<li>Low porosity</li>

			<li>Good solderability</li> 

		</advantage>



		<operating>

			<li>Temp:50-70!</li>

			<li>Au:6-12g/L </li>

			<li>0.1-0.3ASD(barrel)0.1-0.8ASD(rack)</li>

			<li>Anode: Platinum clad titanium </li>

		</operating>

	</subgroup>



	<subgroup name ="Strike Au">

		<product>

			<pname>AuRoTech Strike </pname>

			<introduction>

				<li>Gold electrodeposit strike</li>

				<li>Rate: 1ASD 0.2¼m/min</li>

			</introduction>

		</product>

                

		<advantage>

			<li>Bear contaminant wide range</li>

			<li>Protect hard gold solution  reduce deposit porosity</li>

		</advantage>



		<operating>

			<li>Temp:30-40 !</li>

			<li>Au: 1-2 g/L</li>

			<li>pH: 3.8-4.0 </li>

			<li>0.1-1.0 ASD</li>

			<li>Anode: Platinum clad titanium</li>

		</operating>

	</subgroup>



	<subgroup name ="HS Hard Gold">

		<product>

			<pname>AuRoTech AuNi HS</pname>

			<introduction>

				<li>Special used for connector</li>

				<li>HS, Hard gold, Contain nickel</li>

			</introduction>

		</product>

                

		<product>

			<pname>AuRoTech AuCo HS</pname>

			<introduction>

				<li>Special used for connector</li>

				<li>HS, Hard gold, Contain nickel</li>

			</introduction>

		</product>



		<advantage>

			<li>Hardness: 140-200KHN25</li>

			<li>Purity: >99.7</li>

			<li>10ASD 2.5¼m/min</li>      

		</advantage>



		<operating>

			<li>Temp:25-50 !</li>

			<li>Au: 12-24 g/L</li>

			<li>Ni(Co): 0.8-1.25 g/L</li>

			<li>pH: 4.2-4.5 </li>

			<li>5-60 ASD</li>

			<li>Anode: Platinum clad titanium</li>

		</operating>

	</subgroup>



</group>